OBRABOTKAMETALLOV MATERIAL SCIENCE Том 23 № 3 2021 EQUIPMEN . INSTRUM TS Vol. 7 No. 2 2025 When forming a sharp interface between dissimilar materials, it is necessary to stop the deposition of one material before initiating the deposition of the other. Thus, immediately after depositing the Nth layer with iron alloy wire, the wire feed is switched to copper alloy wire (Fig. 3) Fig. 3. Schematic of the wire-feed electron beam additive manufacturing process for fabricating bimetallic samples with a sharp interface between iron and copper alloys To manufacture a bimetal with a sharp interface between iron and copper alloys, iron alloy wire was deposited layer by layer to create from 10 to 30 layers. Upon completion of the additively grown area of the iron alloy, the steel wire feed was completely stopped, and copper alloy wire was fed into the melt pool using a second feeder. Further, the N + 1 layers or the first layers of the copper alloy were deposited with different 3D printing parameters, taking into account the different physical and mechanical properties of the materials. Visualization of changes in 3D printing parameters was carried out by changing the heat input values for each layer to gain a comprehensive understanding of the structures and defects in additively grown areas during manufacturing by additive methods. The heat input value is a characteristic of the thermal gradient, the amount of linear energy released per unit length of the layer [17]. The value of heat input in the manufacture of bimetallic specimens with a sharp interface between dissimilar materials is shown in Fig. 4. The deposition of layers with iron alloy wire was carried out based on already known data [18]. Deposition of copper alloy wire layers using the same parameters is impossible. When selecting parameters a b c Fig. 4. Variation of heat input values as a function of layer during EBAM of a bimetallic sample with a sharp interface between dissimilar materials: a – 0.12 C-18 Cr-9 Ni-Ti and M1; b – 0.12 C-18 Cr-9 Ni-Ti and Cu-9 Al-2 Mn; c – 0.09 C-2 Mn-Si and Cu-9 Al-2 Mn
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